A stress analysis was carried out for both the peel strength and T260 tests. This analysis clearly showed the T260 test to be a superior choice for measuring the adhesion performance of PCBs during thermal excursions such as experienced in assembly. The utility of the T260 measurement was then demonstrated by comparing the adhesive strength of two sets of coupons using these two adhesion promoting coatings. While the peel strength measurement normally finds the Black Oxide coating to be superior to the Alternative Coatings, the comparison using the T260 measurement finds the strength of the coatings to be equivalent which is in keeping with most observations.
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