Insulator Deposition for Through Conductor Editing

机译：用于导体编辑的绝缘子沉积

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Circuit Edit (CE) through a conductor requires an insulator tornisolate the connection transiting the conductor. Werninvestigate several recipes to determine not just the optimumrnrecipe but also the latitude to provide a means of throughputrnoptimization for a given edit requirement. The results showrnthat trade-offs in deposition rate, robustness and isolationrnquality can be made to enable this throughput optimization.

机译：通过导体的电路编辑（CE）需要绝缘体来隔离通过导体的连接。 Wern研究了几种方法，不仅可以确定最佳配方，还可以确定为给定编辑需求提供吞吐量优化方法的自由度。结果表明，可以在沉积速率，鲁棒性和隔离质量之间进行权衡，以实现这种通量优化。

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《ISTFA 2008 : Conference proceedings from the 34th international symposium for testing and failure analysis》|2008年|151-156|共6页
会议地点 Portland OR(US);Portland OR(US)
作者
Chris Richardson; rnTahir Malik; rnJerrold P Barone;
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Mark Martin LSI Corporation, Fort Collins, CO LSI Corporation, Danfield Court, Fort Collins, Colorado, 80525 Tel: (970) 206-5456 Email: chris.richardson@lsi.com;

DCG Systems, Northport Loop East, Fremont, California, 94538 Tel: (510) 897-6800 Email: tahir_malik@dcgsystems.com;

DCG Systems, Northport Loop East, Fremont, California, 94538 Tel: (510) 897-6800 Email: tahir_malik@dcgsystems.com;

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4. Insulator Deposition for Through Conductor Editing [C] . Chris Richardson, Tahir Malik, Jerrold P Barone International Symposium for Testing and Failure Analysis . 2008

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Insulator Deposition for Through Conductor Editing

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