首页> 外文会议>Joint 2015 e-Manufacturing amp; Design Collaboration Symposium 2015 and 2015 International Symposium on Semiconductor Manufacturing >Advanced high accuracy scanning electron microscopy review methodology by virtual defect — Yiting Kuo
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Advanced high accuracy scanning electron microscopy review methodology by virtual defect — Yiting Kuo

机译:虚拟缺陷的先进高精度扫描电子显微镜检查方法—郭一亭

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摘要

The exact location of defect is very important for review SEM. It is necessary to provide high accuracy defect review with line width shrinkage in manufacture of semiconductor. In this paper, we proposed a new methodology of defect deskew by virtual defects (VD) which provide high accuracy defect review. Furthermore, we also compare the result of different inspection modes and different pixel sizes.
机译:缺陷的确切位置对于审查SEM非常重要。在半导体制造中,必须提供具有线宽收缩的高精度缺陷检查。在本文中,我们提出了一种通过虚拟缺陷(VD)进行缺陷去歪斜的新方法,该方法可提供高精度的缺陷检查。此外,我们还比较了不同检查模式和不同像素大小的结果。

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