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首页> 外文会议>Measurement and Control of Granular Materials(MCGM 2006) >Hot Deformation Behaviour Of Al 6061 Alloy/Sicp Composite
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Hot Deformation Behaviour Of Al 6061 Alloy/Sicp Composite

机译：Al 6061合金/ Sicp复合材料的热变形行为。

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In the present investigation the hot deformation behaviour of 6061Al alloy/SiCp composite was studied and compared with unreinforced aluminium alloy. The materials has been fabricated by a pressurized air infiltration ( PAI ) technique followed by the vortex method. The volume fraction of SiC particles was kept constant about 15%. The composite specimens were produced in the form of cast ingots of dimensions 20×20×110 mm. Compression tests were performed at different strain rates of 0.1, 1.0, and 5.0 s~(-1) under different temperatures ranging; from 100 to 500 ℃. It was found that the flow stress decreases with the increase of temperature at constant strain rate. On the other hand, the flow stress increases with the increase of the strain rate. The activation energy of hot deformation was also higher, which suggests that the ceramic particles caused the matrix to undergo additional strain hardening durining deformation, particularly at lower temperatures. This was attributed to the localised increase both in strain and strain rate in regions of the matrix adjacent to the particulates.It was also found that the fracture strain of the Al6061/15vol.%SiCp composite is much lower, than those of the Al6061 alloy. This could be attributed to the high dislocation density in MMC which causes higher stress concentration at particles interfaces. Thus, the forming limit diagram has increased with the increase in the temperature and the variation of strain rate has a significant effect on hot workability.
机译：在本研究中，对6061Al合金/ SiCp复合材料的热变形行为进行了研究，并将其与未增强铝合金进行了比较。该材料是通过加压空气渗透（PAI）技术以及涡旋法制造的。 SiC颗粒的体积分数保持恒定约15％。复合样品以尺寸为20×20×110 mm的铸锭形式生产。在不同的温度范围内，以0.1、1.0和5.0 s〜（-1）的不同应变率进行压缩测试； 100至500℃。研究发现，在恒定应变速率下，流动应力随着温度的升高而减小。另一方面，流动应力随着应变率的增加而增加。热变形的活化能也更高，这表明陶瓷颗粒使基体经历了额外的应变硬化，持续变质变形，特别是在较低温度下。这归因于与颗粒相邻的基体区域的应变和应变率的局部增加，并且还发现Al6061 / 15vol。％SiCp复合材料的断裂应变比Al6061合金的断裂应变低得多。这可能归因于MMC中的高位错密度，这导致了颗粒界面处的较高应力集中。因此，成形极限图随着温度的升高而增加，并且应变速率的变化对热加工性具有显着影响。

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