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Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

机译:各向异性导电膜粘合的亚100微米间距,柔性至ITO /玻璃互连的可靠性研究

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The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.
机译:这项研究的目的是对3M Z轴(各向异性)导电膜进行鉴定,以用于要求ITO /玻璃连接小于100 / spl mu / m间距弯曲的应用。对于环境稳定性测试,研究了以下加速老化条件:100 / spl deg / C干燥,125 / spl deg / C干燥,-40 / spl deg / C / 100 / spl deg / C循环,-55 / spl循环deg / C / 125 / spl deg / C冲击,60 / spl deg / C / 95%RH和85 / spl deg / C / 85%RH。在环境老化之后,我们检查了这些键的电性能和剥离性能。

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