Micro-bias-tees using micromachined flip-chip inductors

机译：使用微机械倒装电感器的微偏置三通

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In order to reduce the circuit area required by bias-tees in active circuits, an approach using a micromachined suspended inductor is presented in this paper. The inductor is fabricated using a commercial silicon micromachining process and then integrated with a microwave circuit using flip-chip assembly. Suspending the inductor above the substrate greatly reduces the parasitic capacitances associated with the substrate. The inductor has a measured self-resonant frequency of 18 GHz. A tethered approach allows "pre-releasing" of the structure, which makes integration possible on any substrate. 4-mm/sup 2/ bias-tees on both alumina and TMM6 substrates are presented in this work with comparable performance to commercially available bias-tees, but with a significant reduction in circuit area.

机译：为了减少有源电路中的偏置T恤所需的电路区域，本文提出了一种使用微机械悬挂电感的方法。使用商业硅微机械加工制造电感，然后使用倒装芯片组件与微波电路集成。悬挂基板上方的电感大大减少了与基板相关的寄生电容。电感器具有18 GHz的自谐振频率。系绳方法允许结构的“预先释放”，这使得可以在任何基板上进行积分。在这项工作中向氧化铝和TMM6基板上提供4毫米/ Sup 2 /偏置T恤，其具有与市售的偏压的相当的性能，但电路区域的显着减少。

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《》|2003年|p.491-494|共4页
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Bell; P.J.; Bright; V.M.; Popovic; Z.;
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中图分类无线电电子学、电信技术;
关键词
inductors; micromachining; flip-chip devices; micro-bias-tee; micromachined suspended inductor; silicon micromachining process; active microwave circuit; flip-chip assembly; parasitic capacitance; self-resonant frequency; alumina substrate; TMM6 subs;

机译：电感器;微机械加工;倒装芯片器件;微偏置三通;微机械悬浮电感器;硅微机械加工工艺;有源微波电路;倒装芯片组装;寄生电容;自谐振频率;氧化铝基板; TMM6接头;

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2. A Flip-Chip Assembled Millimeter-Wave Oscillator Stabilized with a Micromachined Cavity on a Thin-Film Substrate [J] . Sangsub Song, Youngmin Kim, Youngwoo Kwon, Japanese journal of applied physics . 2009,第4issue2期

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3. A flip-chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications [J] . Panchawagh HV, Faheem FF, Herrmann CF, Sensors and Actuators, A. Physical . 2007,第1期

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4. Micro-bias-tees using micromachined flip-chip inductors [C] . Bell P.J., Bright V.M., Popovic Z. IEEE MTT-S International Microwave Symposium . 2003

机译：使用微机械倒装芯片电感器的微偏置
5. Micromachined inductors and transformers for miniaturized power converters. [D] . Meyer, Christopher D. 2012

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6. Method of Calculating the Inductance Value of MEMS Suspended Inductors with Silicon Substrates [O] . Yiyuan Li, Jianhua Li, Lixin Xu 2018

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7. Metal-embedded SU-8 Slab Techniques for Low-resistance Micromachined Inductors [O] . Manot Mapato, Prapong Klysuban, Thanatchai Kulworawanichpong, 2018

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8. High-Q X-Band and K-Band Micromachined Spiral Inductors for Use in Si-Based ICs [R] . Lu, Liang-Hung, Bhattacharya, Pallab, Katehi, Linda P. B., 2000

机译：用于si基IC的高Q X波段和K波段微机械螺旋电感器

Micro-bias-tees using micromachined flip-chip inductors

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