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Reliability assessment for The Polymer Stud Grid Array (PSGA~(TM)) Package

机译：聚合物螺柱网格阵列（PSGA〜（TM））封装的可靠性评估

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The Polymer Stud Grid Array (PSGA~(TM)) is an innovative package and enters the market to fulfil the demands of the ongoing miniaturisation combined with cost reduction. In this paper, a full description of the qualification results for this new package technology is given. This qualification includes the determination of the thermal behaviour, the high frequency electrical characterisation and the first and second level reliability. Both experimental testing as well as the use of simulation techniques result in an optimal design for this PSGA.

机译：Polymer Stud Grid Array（PSGA〜（TM））是一种创新的包装，已进入市场以满足不断小型化和降低成本的需求。本文对这种新包装技术的鉴定结果进行了完整描述。该鉴定包括热性能的确定，高频电特性以及第一和第二级可靠性。实验测试以及模拟技术的使用都为该PSGA提供了最佳设计。

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《》|2000年|p.35-45|共11页
会议地点 Helsingor(DK);Helsingor(DK)
作者
Bart Vandevelde; Evelien Driessen; Arun Chandrasekhar; Eric Beyne;
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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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专利

1. Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package [J] . Bart Vandevelde, Eric Beyne Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 1999,第3期

机译：聚合物螺柱栅格阵列（PSGA）封装上倒装芯片组件的热疲劳分析
2. Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly [J] . Xi Liu, Jiantao Zheng, Suresh K. Sitaraman Journal of Electronic Packaging . 2010,第2期

机译：球栅阵列封装组件热界面材料的湿热力学可靠性评估
3. Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors [J] . Gerke R.D., Kromann G.B. IEEE Transactions on Components and Packaging Technologies . 1999,第4期

机译：高I / O陶瓷球栅阵列和陶瓷四方扁平包装在计算机环境中的焊点可靠性：PowerPC 603 / sup TM /和PowerPC 604 / sup TM /微处理器
4. Reliability assessment for The Polymer Stud Grid Array (PSGA~(TM)) Package [C] . Bart Vandevelde, Evelien Driessen, Arun Chandrasekhar, IMAPS Nordic annual conference . 2000

机译：聚合物螺柱栅格阵列的可靠性评估（PSGA〜（TM））包装
5. Temperature cycling reliability of reballed and reworked ball grid array packages in tin-lead and SAC assembly. [D] . Nie, Lei. 2010

机译：锡铅和SAC组件中经过重新焊锡和重新加工的球栅阵列封装的温度循环可靠性。
6. Evaluation of the packaging and encapsulation reliability in fully integrated fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality [O] . A. Sharma, L. Rieth, P. Tathireddy, -1

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7. A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load [O] . Akihiro YAGUCHI, Munehiro YAMADA, Kenichi YAMAMOTO 2003

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Reliability assessment for The Polymer Stud Grid Array (PSGA~(TM)) Package

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