【24h】

DC characteristic analysis of AlGaN/GaN HEMT and MOSHEMT

机译:Algan / GaN Hemt和MoShemt的DC特征分析

获取原文

摘要

In this paper we have improved the DC characteristics of conventionally used AlGaN/GaN High electron mobility transistor (HEMT) by inserting an oxide layer (HfO_2) in between the metal gate and the AlGaN barrier layer. The analysis of DC characteristics of newly simulated AlGaN/GaN metal oxide semiconductor High electron mobility transistor (MOSHEMT) device shows enhanced performance in comparison to the AlGaN/GaN HEMT device. Both the devices are simulated by using Synopsys Technology Computer Aided Design (TCAD). Various DC parameters such as I_D-V_D, I_D-V_G, I_(ON)/I_(OFF) ratio, leakage current and sheet charge density for both the devices are extracted and analyzed. After comparison of important DC parameters, MOSHEMT shows enhanced performance over HEMT.
机译:在本文中,我们通过在金属栅极和AlGAN阻挡层之间插入氧化物层(HFO_2),改善了传统使用的AlGaN / GaN高电子迁移率晶体管(HEMT)的DC特性。新模拟AlGaN / GaN金属氧化物半导体高电子迁移率晶体管(MOSHEMT)装置的DC特性分析显示了与AlGaN / GaN HEMT装置相比的增强性能。通过使用Synopsys Technology计算机辅助设计(TCAD)模拟这两种设备。提取和分析了各种DC参数,例如I_D-V_D,I_D-V_G,I_(ON)/ I_(OFF)比率,漏电流和磁盘充电密度,并分析。在比较重要的DC参数之后,MOSHEMT显示出在HEMT上的增强性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号