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Two-dimensional simulation of ion energy and angular distributionsat the wafer in low-pressure RF discharges

机译:离子能量和角度分布的二维模拟在晶片上以低压RF放电

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Summary form only given. We have developed a two-dimensional,electromagnetic, PIC-MCC code to study the ion energy and angulardistributions in the RF biased sheaths. At the bulk-sheath boundary, theion flux distribution into the sheath region can be specified, say, fromour simple two-dimensional fluid simulation slightly different fromParanjpe's (1994) in that we use global model to determine the electrontemperature. The electron flux into the sheath region is adjusted tosatisfy the quasi-neutrality condition at every fixed time intervalduring the simulation. We will present simulation results of ion energyand angular distributions, ion flux incident on the wafer, and self-biasat the wafer as a function of the applied RF frequency, the amplitude ofthe RF bias, ion mass, and the blocking capacitance. The results fromparticle simulations will also be compared with analytic calculations.We found if the incoming ion flux is uniform, then the ion flux strikingthe wafer remains nearly uniform across the wafer. The spread of ionangular distribution was found to be larger near the wafer's edge thanthe center of the wafer
机译:仅提供摘要表格。我们已经开发了二维 电磁,PIC-MCC代码以研究离子能量和角度 射频偏置护套中的分布。在散装护套边界处, 可以通过以下方式指定进入鞘区域的离子通量分布: 我们简单的二维流体模拟与 Paranjpe(1994)的研究中,我们使用全局模型来确定电子 温度。调节进入鞘区的电子通量为 在每个固定的时间间隔内满足准中立条件 在模拟过程中。我们将介绍离子能的模拟结果 和角度分布,入射在晶片上的离子通量以及自偏压 在晶片上的频率取决于所施加的RF频率的幅度 RF偏置,离子质量和阻挡电容。结果来自 粒子模拟也将与解析计算进行比较。 我们发现如果入射离子通量是均匀的,那么离子通量就会达到 晶圆在整个晶圆上几乎保持均匀。离子的扩散 发现晶片边缘附近的角度分布大于 晶圆中心

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