首页> 外文会议>International VLSI multilevel interconnection conference;VMIC >HYDROGEN CONCENTRATION ANALYSIS IN SEQUENTIALLY DEPOSITED THIN FILMS AND APPLICATION OF SURFACE CHARGE ANALYSIS TECHNIQUE FOR FAST AND NON-DESTRUCTIVE CHARACTERIZATION OF PECVD SILICON NITRIDE
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HYDROGEN CONCENTRATION ANALYSIS IN SEQUENTIALLY DEPOSITED THIN FILMS AND APPLICATION OF SURFACE CHARGE ANALYSIS TECHNIQUE FOR FAST AND NON-DESTRUCTIVE CHARACTERIZATION OF PECVD SILICON NITRIDE

机译:顺序沉积薄膜中的氢浓度分析及表面电荷分析技术在PECVD氮化硅快速无损表征中的应用

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摘要

As parts of silicon nitride PECVD process optimization, a SIMS hydrogen concentration analysis in sequentially deposited CVD layers used for device manufacturing, and trends of the average total charge changes measured using surface charge analysis technique in the silicon nitride layer are analyzed.
机译:作为氮化硅PECVD工艺优化的一部分,分析了用于器件制造的顺序沉积的CVD层中的SIMS氢浓度分析,以及在氮化硅层中使用表面电荷分析技术测得的平均总电荷变化趋势。

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