INTERCONNECT PASSIVE COMPONENTS FOR MIXED SIGNAL/RF APPLICATIONS

机译：用于混合信号/ RF应用的互连无源组件

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High performance passive components are a necessity for today's integrated mixed signal and RF circuits. Low resistance interconnects allow integration of high quality metal-insulator-metal (MIM) capacitors, lateral MIM capacitors, inductors, transformers, fuses, and transmission lines. In this paper, performance issues of these interconnect passive components and their integration into subtractive Al process and dual damascene Cu process are described. The migration of capacitors towards high-k dielectrics such as Ta_2O_5, characterization of free lateral MIM capacitors and results of integration of photo-BCB as a thick dielectric to improve upon inductor Q are also presented.

机译：高性能无源元件是当今集成的混合信号和RF电路所必需的。低电阻互连允许集成高质量的金属-绝缘体-金属（MIM）电容器，横向MIM电容器，电感器，变压器，熔断器和传输线。在本文中，描述了这些互连无源组件的性能问题，以及它们在减法Al工艺和双镶嵌Cu工艺中的集成。还介绍了电容器向高k电介质（例如Ta_2O_5）的迁移，自由横向MIM电容器的特性以及将光BCB集成为厚电介质以改善电感Q的结果。

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《International VLSI multilevel interconnection conference;VMIC》|2000年|p.80-89|共10页
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Arjun Kar-Roy; Phil N. Sherman; Chih-Chieh (Bruce) Shen; Surya Bhattacharya; Paul Kempf;
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中图分类无线电电子学、电信技术;
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2. Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects [J] . Cho J., Song E., Kim H., Electromagnetic Compatibility, IEEE Transactions on . 2011,第3期

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4. Synthesis of RF circuits for embedded passive components in mixed signal applications [C] . Kwang Lim Choi, Swaminathan, M. Electronic Components Technology Conference, 1998. 48th IEEE . 1998

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5. High-performance interconnect and circuit design for millimeter-wave mixed signal silicon MMICs. [D] . Kim, Juno. 2000

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INTERCONNECT PASSIVE COMPONENTS FOR MIXED SIGNAL/RF APPLICATIONS

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