OPTIMIZATION OF BAKING FOR FLARE ORGANIC LOW K DIELECTRIC MATERIAL

机译：闪光有机低介电材料的烘烤优化

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Dual damascene interconnects provide a promising platform for the use of low resistive copper and low dielectric constant materials. However, integration of low dielectric constant materials in dual damascene architecture is challenging due to material and processing issues. This paper examines the integration of an organic low dielectric constant material FLARE in a dual damascene interconnect from the perspective of baking of the organic polymer.

机译：双镶嵌互连为使用低电阻铜和低介电常数材料提供了一个有希望的平台。然而，由于材料和工艺问题，将低介电常数材料集成在双镶嵌结构中是具有挑战性的。本文从烘烤有机聚合物的角度研究了双镶嵌互连中有机低介电常数材料FLARE的集成。

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《International VLSI multilevel interconnection conference;VMIC》|2000年|p.393-397|共5页
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Yi Xu; Simon Y. M. Chooi; Mei-Sheng Zhou; Subhash Gupta;
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中图分类无线电电子学、电信技术;
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OPTIMIZATION OF BAKING FOR FLARE ORGANIC LOW K DIELECTRIC MATERIAL

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