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Thermal Stability Study of HDP FSG for Cu Dual Damascene Application

机译：用于铜双镶嵌的HDP FSG的热稳定性研究

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In contrast with Al process, the gap-fill capability is not required for FSG in Cu dual damascene metallization scheme, which indicates the need for a HDP FSG without bias RF power (UB FSG) due to its higher deposition rate. The thermal stability of UB FSG is studied in this work and is compared with conventional HDP FSG. The typical process concerns of FSG are moisture absorption and thermal. stability. In general, the dielectric constant increases with increasing fluorine concentration. However, FSG with high fluorine concentration becomes easier to absorb moisture when exposed in the atmospheric environment. In this study, the fluorine concentration of UB FSG was found to increase after several thermal cycles. UB FSG properties were characterized by FTIR spectrum and TDS spectrum after several thermal cycles. The results show that UB FSG is comparable to conventional HDP FSG both in moisture absorption and thermal stability. When UB FSG film is integrated with Cu process, a lower dielectric constant FSG film with higher productivity can be achieved.
机译：与Al工艺相比，Cu双镶嵌金属化方案中的FSG不需要间隙填充功能，这表明由于其较高的沉积速率，因此需要无偏置RF功率（UB FSG）的HDP FSG。在这项工作中研究了UB FSG的热稳定性，并将其与传统的HDP FSG进行了比较。 FSG的典型工艺问题是吸湿和散热。稳定。通常，介电常数随着氟浓度的增加而增加。但是，氟浓度高的FSG暴露于大气环境时，容易吸收水分。在这项研究中，发现UB FSG的氟浓度在多次热循环后会增加。几个热循环后，通过FTIR光谱和TDS光谱表征了UB FSG的特性。结果表明，UB FSG的吸湿性和热稳定性均与传统的HDP FSG相当。当UB FSG膜与Cu工艺集成在一起时，可以实现具有更高生产率的更低介电常数的FSG膜。

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