首页> 外文会议>Micro-Nanomechatronics and Human Science, 2004 and The Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004 >In-situ measurements of internal stresses in copper thin films during thermal cycling using synchrotron X-rays
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In-situ measurements of internal stresses in copper thin films during thermal cycling using synchrotron X-rays

机译:使用同步加速器X射线在热循环过程中原位测量铜薄膜中的内部应力

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Using synchrotron X-rays at SPring-8, the internal stress in Cu thin films was measured in vacuum at various temperatures during heating and cooling cycle between room temperature and high temperature of 300 or 500/spl deg/C. Cu films with the thickness of 600 nm was sputtered on top of the under coating of TiN on Si wafer substrate. Cu thin films had a strong fiber texture with the fiber axis >111< perpendicular to the film surface. The 311 diffraction was used for stress measurement. In the heating process, the tensile stress was decreased from 217 MPa to -115 MPa at 180/spl deg/C and then stress relaxation took place at higher temperatures. The stress diminished in the film at 500/spl deg/C. In the cooling process, the tensile stress was built up with decreasing temperature. After one heat cycle, the residual stress was increased from 217 to 367 MPa. The experimental results were compared with the theoretical prediction based on the method proposed by Thouless et al. A good agreement was obtained between experimental and theoretical results.
机译:使用SPring-8上的同步辐射X射线,在室温至300或500 / spl deg / C的加热和冷却循环中的各种温度下,在真空中测量Cu薄膜的内部应力。将厚度为600 nm的Cu膜溅射在Si晶片衬底上的TiN底涂层的顶部。 Cu薄膜具有很强的纤维织构,其纤维轴垂直于薄膜表面> 111 <。 311衍射用于应力测量。在加热过程中,拉伸应力在180 / spl deg / C时从217 MPa降低到-115 MPa,然后在更高的温度下发生应力松弛。在500 / spl deg / C下,薄膜中的应力减小了。在冷却过程中,拉伸应力随着温度的降低而增加。一个热循环后,残余应力从217 MPa增加到367 MPa。实验结果与基于Thouless等人提出的方法的理论预测进行了比较。实验和理论结果之间取得了很好的一致性。

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