Aspects of short-range interconnect packaging

机译：短距离互连封装的各个方面

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In short-range interconnect applications, one question arises frequently: When should optical solutions be chosen over electrical wiring? The answer to this question of course depends on several factors like costs, performance, reliability, availability o

机译：在短距离互连应用中，经常会出现一个问题：什么时候应该选择光学解决方案而不是电线？这个问题的答案当然取决于几个因素，例如成本，性能，可靠性，可用性

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来源
《》|2012年|p.1-6|共6页
会议地点 San Francisco CA(US)
作者
Denis Wohlfeld; Karl-Heinz Brenner;
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作者单位

Ruprecht-Karls-Univ. Heidelberg (Germany);

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会议组织
原文格式 PDF
正文语种 eng
中图分类光电子技术的应用;光电子技术的应用;
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1. Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating [J] . Pradeep Dixit, Chee Wee Tan, Luhua Xu, Journal of Micromechanics and Microengineering . 2007,第5期

机译：通过AZ9260抗蚀剂电镀以高深宽比制造和表征用于高级晶圆级封装的细间距片上铜互连
2. Silicon Micromachining of High Aspect Ratio, High-Density Through-Wafer Electrical Interconnects for 3-D Multichip Packaging [J] . Zheyao Wang, Lianwei Wang, N. T. Nguyen, IEEE Transactions on Advanced Packaging . 2006,第3期

机译：用于3D多芯片封装的高纵横比，高密度晶圆间电互连的硅微加工
3. High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging [J] . Seong Joon Ok, Chunho Kim, Baldwin D.F. IEEE Transactions on Advanced Packaging . 2003,第3期

机译：用于MEMS封装的高密度，长宽比高的晶片互连互连通孔
4. Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging [C] . Liyi Li, Jiali Wu, Wong C.P. IEEE Electronic Components and Technology Conference . 2015

机译：具有3D封装的高密度互连的硅中介层的晶片级湿法高纵横比的硅通孔（TSV）具有高均匀性和低成本
5. Electrical, thermal, and architecture aspects of VLSI packaging and interconnects for high-speed digital computers. [D] . Pence, William Edward, IV. 1989

机译：高速数字计算机的VLSI封装和互连的电气，热和体系结构方面。
6. Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain [O] . Nathan Jackson, Jit Muthuswamy -1

机译：灵活的芯片刻度封装和互连的植入MEMS可移动微电极进行大脑
7. Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect [O] . Y.S. Liu 2012

机译：基于聚合物的光学互连技术：通往低成本光电封装和互连的途径
8. Control Aspects of the Launch Phase of a Vertically-Launched Short-Range Surface-to-Air Missile [R] . West, S. P. 1986

机译：垂直发射的短程地空导弹发射阶段的控制方面

Aspects of short-range interconnect packaging

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