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首页> 外文会议>Electronics Manufacturing Technology Symposium, 2004 >Package design optimization and materials selection for stack die BGA package
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Package design optimization and materials selection for stack die BGA package

机译：堆叠芯片BGA封装的封装设计优化和材料选择

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摘要

Due to an expanding consumer electronics market and the need for form factor reduction, stack packages have been gaining popularity in the last 3 years. With the incorporation of silicon die stacking, there is a corresponding increase in biomaterial coupling and interfacial adhesion becomes a prime reliability under the exposure of both moisture and thermal excursion. With the requirement for higher solder reflow temperatures for lead-free applications, the problem becomes even more severe. It becomes increasingly important to understand the combined effects of material selection and package structure on the interfacial delamination under temperature excursion in the presence of moisture. This paper presents a detailed analysis into the effects of packaging materials and structure on interfacial delamination under temperature excursion in the presence of moisture for two die stack fine pitch BGA (D2-FBGA). Upfront analysis based on thermo-mechanical modelling is performed prior to a full design of experiments (DOE) investigation. The current DOE matrix includes variation in mold compound delamination and other test factors such as geometrical variations in die stacking and the selection of mold compound influence the intensity of delamination.
机译：由于不断扩大的消费电子产品市场以及对减小外形尺寸的需求，在过去的三年中，堆叠式封装已变得越来越流行。随着硅管芯堆叠的结合，生物材料的耦合也相应增加，并且在暴露于湿气和热偏移下，界面粘合成为主要的可靠性。在无铅应用中需要更高的焊料回流温度的情况下，问题变得更加严重。了解材料选择和包装结构对存在水分的温度偏移下界面分层的综合影响变得越来越重要。本文对两个管芯叠层细间距BGA（D2-FBGA）在存在水分的温度偏移下，包装材料和结构对界面分层的影响进行了详细分析。在进行完整的实验设计（DOE）研究之前，需要进行基于热机械模型的前期分析。当前的DOE矩阵包括模塑料分层的变化和其他测试因素，例如模头堆叠中的几何变化以及模塑料的选择会影响分层的强度。

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