首页> 外文会议>European photovoltaic solar energy conference >COMPARISON OF TEST METHODS FOR STRENGTH CHARACTERIZATION OF THIN SOLAR WAFER
【24h】

COMPARISON OF TEST METHODS FOR STRENGTH CHARACTERIZATION OF THIN SOLAR WAFER

机译:薄太阳能晶片强度表征测试方法的比较

获取原文

摘要

The Photovoltaic industry still tends towards thinner wafers with larger area leading to higher breakagerate in production processes. Strength characterization is needed in order to understand the fracture process and tooptimize process steps. In this work different methods to measure the strength of photovoltaic wafer are presentedand performed. Due to large deflection in experiment non-linear numerical methods must be used for strengthevaluation. Besides the large influence of thickness variation it was found that the 4-point bending test and the ballon-ring test are appropriate test methods. In twist test calculating reliable fracture stress values in comparison to thefracture behavior was more difficult. This test method seems to be less suitable for strength characterization.
机译:光伏行业仍然倾向于使用更薄的晶圆,更大的面积导致更大的破损率。 生产过程中的速度。为了了解断裂过程并进行强度分析,需要进行强度表征。 优化流程步骤。在这项工作中,提出了测量光伏晶片强度的不同方法 并表演。由于实验中存在较大的挠度,因此必须使用非线性数值方法来获得强度 评估。除了厚度变化的巨大影响外,还发现四点弯曲试验和气袋 振铃测试是适当的测试方法。在扭转试验中,与 骨折行为更加困难。该测试方法似乎不太适合强度表征。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号