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Effects of Large Temperature Cycling Range on Direct Bond Aluminum Substrate

机译：大温度循环范围对直接粘结铝基板的影响

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The substrate reliability has been a long time concern for systems exposed to harsh enviornments. The state of the art direct bond copper (DBC) substrate is susceptible to large temperature cycling range, delamination of copper from the ceramic base-plate caused by the thermomechanical stress is often observed. In this work, effects of large temperature cycling range on direct bond aluminum (DBA) substrate reliability have been investigated. DBA substrates with different metallizations are thermally cycled between -55°C and 250°C. Unlike the failure mode of the DBC substrate, no delamination of aluminum from ceramic base-plate is found for the DBA substrate. However, we notice that the substrates suffer the increased surface roughness after the thermal cycling test. It is believed that in the high temperature regime, due to the significant amount of thermal stress and grain-scale deformation, recrystallization and grain-boundary sliding become very active in the aluminum layer, and thus cause the microstructural evolution. The influences of metallization of DBA substrate on surface roughness have also been characterized.
机译：对于暴露于恶劣环境的系统，基板可靠性一直是长期关注的问题。现有技术的直接键合铜（DBC）基板易受较大温度循环范围的影响，经常观察到由热机械应力引起的铜与陶瓷基板的分层。在这项工作中，已经研究了大温度循环范围对直接键合铝（DBA）基板可靠性的影响。具有不同金属镀层的DBA基板在-55°C至250°C之间进行热循环。与DBC基板的故障模式不同，对于DBA基板，没有发现铝从陶瓷基板上分层。但是，我们注意到在热循环测试后，基材的表面粗糙度增加了。可以认为，在高温状态下，由于大量的热应力和晶粒尺寸变形，再结晶和晶界滑动在铝层中变得非常活跃，从而引起微观结构的演变。还已经表征了DBA基板的金属化对表面粗糙度的影响。

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