ALTCC Material with Low Temperature Coefficient of Resonance Frequency

机译：ALTCC材料具有低温度谐振频率系数

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For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonance frequency (TCF) is an important factor. To meet these demands, we developed a new LTCC material with a smaller TCF, less than +/-3ppm/deg C, and a low loss tangent, 0.0012 at 15GHz. We designed the glass composition to precipitate two low-loss crystal phases during firing at 900 deg C. One phase has a plus TCF and the other phase has a minus TCF. We also controlled the amount of the two crystal phases, so these crystal phases and the fixed amount of alumina filler make the sum of TCF for the LTCC material close to zero.

机译：对于高频包装应用，LTCC材料需要具有低损耗，以减少总微波损耗。对于具有嵌入无源元件的多层陶瓷器件，除了损耗切线之外，谐振频率的小温度系数（TCF）是一个重要因素。为满足这些需求，我们开发了一种具有较小TCF，小于+/- 3ppm / deg C的新型LTCC材料，低损耗正切，0.0012，为15GHz。我们设计了玻璃组合物，以在烧制时在900℃下析出两个低损耗晶相。一相具有加TCF，另一相具有减去TCF。我们还控制了两个晶相的量，因此这些晶相和固定量的氧化铝填料使得LTCC材料接近零的LTCC材料的总和。

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来源
《Electronics Division Meeting of the Ceramic Society of Japan》|2005年||共4页
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作者
Masaru Iwao; Yoshio Umayahara; Kazuyoshi Shindo;
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中图分类 TQ174-532;
关键词
LTCC; TCF; Loss tangent; crystallization; XRD;

机译：LTCC;TCF;损失切线;结晶;XRD;

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ALTCC Material with Low Temperature Coefficient of Resonance Frequency

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