In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.
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