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首页> 外文会议>61st Electronic Components Technology Conference, 2011 >Impact of board configuration and shock loading conditions for board level drop test
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Impact of board configuration and shock loading conditions for board level drop test

机译：电路板配置和冲击负载条件对电路板电平下降测试的影响

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An effort has been made in this study to evaluate the dynamics and characteristics of the test vehicle in a board level drop test. A thorough understanding of the behavior of the test vehicle is examined by characterizing its response under different test profiles and board dimensions. This is done in an attempt to optimize the test procedure used to qualify electronic products subjected to high strain rate drop/shock environment. The effects of peak acceleration and change in velocity of the impact pulse on the reliability of the test vehicle have been studied. In situ strain measurements have been used to aid us in characterizing the board response under high strain rate loading conditions. Also finite element analysis has been used to better understand the board response under different loading conditions. Based on the experimental results and analysis, ways to improvise the drop test setup have been discussed.
机译：在这项研究中，已经做出了努力来评估板级跌落测试中测试车辆的动力学和特性。通过表征其在不同测试配置文件和电路板尺寸下的响应，可以全面了解测试车辆的行为。这样做是为了优化用于鉴定经受高应变速率下降/冲击环境的电子产品的测试程序。研究了峰值加速度和冲击脉冲速度变化对测试车辆可靠性的影响。原位应变测量已用于帮助我们表征高应变速率加载条件下的板响应。此外，有限元分析已被用来更好地了解板在不同负载条件下的响应。根据实验结果和分析，讨论了改进跌落测试设置的方法。

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