• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>European Microwave Integrated Circuits Conference >Thales Components and Technologies for T/R Modules
【24h】

Thales Components and Technologies for T/R Modules

机译：Thales T / R模块的组件和技术

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This paper presents new developments and perspectives in Phased Arrays Radars and Electronic Warfare for the next generations of T/R modules (medium/long term), in order to decrease the mass production cost, while increasing the level of performance and reliability. In terms of physical architecture, even if the brick one is more current at mid-term, the tile concept is investigated for conformal and/or multifunction phased array antennas : a 3 dimension module will lead to a drastic reduction of size and weight of the antenna. MMICs are always the key components, with evolutions towards multifunction chips, new processes like GaN, SiGe, MEMS power switches. Concerning the packaging, a technological roadmap indicates the different capabilities : thick film multilayer ceramic circuits, co-fired ceramics based on LTCC or HTCC processes, surface-mounted packages on printed circuits boards, and 3D architectures. The interconnection domain is also now more and more important in order to be compatible with the level of integration required for the microwave modules : fuzz buttons, flex, sub-miniature connectors. All these, technologies mastered by Thales are dual for Airborne and Space, Military and Civilian applications.
机译：本文呈现的新发展和观点在相控阵雷达和电子战为T / R模块（中期/长期），的下一代为了降低批量生产成本，同时提高性能和可靠性的水平。在物理体系结构而言，即使砖一个在中期是更多的电流，瓦片概念研究用于保形和/或多功能相控阵天线：一个3维模块会导致尺寸的急剧降低和重量的天线。的MMIC总是的关键部件，具有朝向多功能芯片，新工艺等的GaN，硅锗，MEMS电源开关演变。关于包装，一个技术路线图表示不同的功能：厚膜多层陶瓷电路，基于LTCC或HTCC过程共烧陶瓷，​​表面安装在印刷电路板产品的三维结构。互连域也是现在为了越来越重要的是与用于微波模块所需的集成水平兼容：绒毛按钮，弯曲，超小型连接器。所有这些，由泰利斯公司掌握的技术是双机载航天，军事和民用领域。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号