首页> 外文会议>International IEEE/EMBS Conference on Neural Engineering >Distributed Intracortical Neural Interfacing: Network protocol design
【24h】

Distributed Intracortical Neural Interfacing: Network protocol design

机译:分布式内部神经连接:网络协议设计

获取原文

摘要

New high-performance neural interfacing approaches are demanded for today's Brain-Machine Interfaces (BMIs). In this paper, we present the architecture of a wireless network of implantable microsystems (Brain-ASNET: Brain Area Sensor NETwork). As well, we introduce an energy-efficient ad-hoc network protocol for the desired network, along with a method to overcome issue of variable packet length caused by bit stuffing process in HDLC standard protocol. To implement the idea, architecture and design of a System-on-a-Chip (SoC) is also presented. The SoC can be configured to be used either as a sensor node chip or the network coordinator's RF front-end and network controller. The SoC is designed and laid-out in an IBM 0.13μm CMOS process. The post-layout simulation results show energy efficiency of the designed ad-hoc network protocol and low power dissipation of the SoC. The whole chip, including all functional and peripheral integrated components, consumes 138μW and 412μW, at 1.2V, configured in a synchronized network as a sensor node and the coordinator, respectively.
机译:为当今的脑机接口(BMI)要求新的高性能神经接口方法。在本文中,我们介绍了植入微系统的无线网络(脑 - ASNET:脑区域传感器网络)的架构​​。同样,我们为所需网络引入了节能的Ad-hoc网络协议,以及一种克服由HDLC标准协议中的比特填充过程引起的可变分组长度问题的方法。为了实现一个芯片(SoC)的想法,体系结构和设计也是如此。 SOC可以配置为作为传感器节点芯片或网络协调器的RF前端和网络控制器使用。 SOC在IBM0.13μmCMOS过程中设计和布局。后布局仿真结果显示了设计的ad-hoc网络协议的能效和SoC的低功耗。整个芯片,包括所有功能和外围集成组件,消耗138μW和412μW,在1.2V下,分别以同步网络配置为传感器节点和协调器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号