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首页> 外文会议>International Conference on Electronic Packaging Technology >The Cu@SiO_2 Core-Shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis
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The Cu@SiO_2 Core-Shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis

机译：Cu / 2核 - 壳纳米颗粒填充聚偏二氟乙烯纳米复合材料：制造，表征和介电性分析

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In this paper, the Cu@SiO_2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15-20 nm SiO_2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO_2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I-V properties, which indicates that this film can be used for ESD protection circuit.
机译：在本文中，使用简单的方法合成Cu / 2核 - 壳颗粒，并用XRD和SEM技术良好表征。 TEM的结果表明，厚度为15-20nm SiO_2壳均匀地涂覆在铜颗粒表面上。测量并分析填充有Cu / 2颗粒颗粒的PVDF复合材料的介电性能。结果表明，PVDF柔性复合材料膜的介电常数随着填料含量的增加而增加。此外，19Vol％复合膜具有明显的非线性I-V属性，这表明该膜可用于ESD保护电路。

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