ANALYSIS OF COTTON-LIKE SILICA CONTAMINANTS INDUCED BY OXYGEN CONTAINING PLASMA STRIPPING OF ORGANIC STRUCTURES ON SILICON WAFER

机译：含氧含氧含氧含硅污染物硅晶片的含氧含硅溶液分析

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

The issue of unwanted cotton-like silica contaminants formed in oxygen containing plasma stripping of organic sacrificial structures on Si substrates is discussed in this paper. The mechanism is developed with specific reference to three common polymer materials in oxygen plasma etching, which is an indispensable process in most MEMS/IC fabrications. The experiments support that exposed silicon, organic structure, plasma bombardment and oxygen containing environment are four essential factors; and the density and shape of the silica residues are mostly determined by the original vertical and planar dimensions of the organic structures. More experiment results manifest that the residues can be avoided or removed with proper methods.

机译：本文讨论了在Si衬底上含氧血浆剥离中形成的含氧血浆剥离的不需要的棉状二氧化硅污染物的问题。该机构是用特定参考氧等离子体蚀刻中的三种普通聚合物材料进行开发的机理，这是大多数MEMS / IC制造中的不可缺少的方法。实验支持，暴露的硅，有机结构，等离子体轰击和含氧环境是四个必要因素;并且二氧化硅残留物的密度和形状主要由有机结构的原始垂直和平面尺寸决定。更多的实验结果表明，可以用适当的方法避免或除去残留物。

著录项

来源
《International Conference on Solid-State Sensors, Actuators and Microsystems》|2013年||共4页
会议地点
作者
D.D. She; L.R. Zhao; Z.Q. Wang; X.Y. Ma; W.G. Wu;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类自动化技术及设备;
关键词
Oxygen plasma stripping; cotton-like silica residues; organic structure; formation mechanism;

机译：氧等离子体剥离;棉状二氧化硅残留物;有机结构;地层机制;

相似文献

外文文献
中文文献
专利

1. Comparison of the removal efficiency for organic contaminants on silicon wafers stored in plastic boxes between UV/O_3 and ECR oxygen plasma cleaning methods [J] . Kyunsuk Choi, Tae-Jong Eom, Chongmu Lee Thin Solid Films . 2003,第1a2期

机译：比较UV / O_3和ECR氧等离子体清洗方法对塑料盒中存储的硅晶片上有机污染物的去除效率
2. Organic Contaminant Detection of Silicon Wafers Using Negative Secondary Ions Induced by Cluster Ion Impacts [J] . Kouichi Hirata, Yuichi Saitoh, Atsuya Chiba, Applied physics express . 2008,第4期

机译：簇离子碰撞诱导的负性二次离子检测硅晶片的有机污染物
3. TXRF Analysis of Low Z Elements and TXRF-NEXAFS Speciation of Organic Contaminants on Silicon Wafer Surfaces Excited by Monochromatized Undulator Radiation [J] . B. Beckhoff, R. Fliegauf, G. Ulm, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2003,第0期

机译：单色波状起伏辐射激发的硅晶片表面低Z元素的TXRF分析和有机污染物的TXRF-NEXAFS形态
4. Analysis of cotton-like silica contaminants induced by oxygen containing plasma stripping of organic structures on silicon wafer [C] . She D.D., Zhao L.R., Wang Z.Q., International Conference on Solid-State Sensors, Actuators and Microsystems . 2013

机译：硅晶片上含氧等离子体剥离有机结构引起的棉状二氧化硅污染物的分析
5. Anisotropic fluorocarbon plasma etching of silicon/silicon germanide heterostructures and plasma etching-induced sidewall damage [D] . Ding, Ruhang 2008

机译：硅/硅锗化物异质结构的各向异性碳氟化合物等离子体刻蚀和等离子体刻蚀引起的侧壁损伤
6. Growth and Self-Assembly of Silicon–Silicon Carbide Nanoparticles into Hybrid Worm-Like Nanostructures at the Silicon Wafer Surface [O] . Manuel Alejandro Perez-Guzman, Rebeca Ortega-Amaya, Yasuhiro Matsumoto, 2018

机译：碳化硅-碳化硅纳米粒子在硅晶片表面的生长和自组装成蠕虫状纳米杂化结构。
7. Computation Program System for Structural Analysis and Quantification of Organic Contaminants on Silicon Wafer Surfaces from Mass Spectra. [O] . Keiji SAITO, Hiroshi SIMIZU, Toshio OGAWA 2000

机译：硅晶片硅晶片表面有机污染物结构分析和定量的计算程序系统。
8. Applications Analysis Report: Silicate Technology Corporation'sSolidification/Stabilization Technology for Organic and Inorganic Contaminants in Soils [R] . Bates, E. 1992

机译：应用分析报告：硅酸盐技术公司对土壤中有机和无机污染物的固化/稳定技术

ANALYSIS OF COTTON-LIKE SILICA CONTAMINANTS INDUCED BY OXYGEN CONTAINING PLASMA STRIPPING OF ORGANIC STRUCTURES ON SILICON WAFER

摘要

著录项

相似文献

相关主题

期刊订阅