Ultrahigh speed transceiver package with stacked silicon integration technology

机译：采用堆叠式硅集成技术的超高速收发器封装

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As carrier frequency going into millimeter wave domain, today's semiconductor IC package enters a domain where many challenges become fundamental to legacy technology and design practice. In this study, we analyze interconnect impairment for ultrahigh speed transceivers. To answer the challenge towards 56Gbps, we assess system compensation schemes from silicon equalization to passive interconnect innovations. The author will specifically address recent advancement in stacked silicon integration technology (SSIT) and its role in 400G/1TB system solutions.

机译：随着载波频率进入毫米波领域，当今的半导体IC封装进入了一个领域，在该领域中，许多挑战已成为传统技术和设计实践的基础。在这项研究中，我们分析了超高速收发器的互连损耗。为了应对56Gbps的挑战，我们评估了从硅均衡到无源互连创新的系统补偿方案。作者将特别介绍堆叠硅集成技术（SSIT）的最新进展及其在400G / 1TB系统解决方案中的作用。

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《IEEE Electronics Packaging Technology Conference》|2014年|261-264|共4页
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Hong Shi;
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integrated circuit interconnections; integrated circuit packaging; silicon; transceivers; SSIT; carrier frequency; interconnect impairment; millimeter wave domain; passive interconnect innovation; semiconductor IC package; silicon equalization; stacked silicon integration technology; system compensation scheme; ultrahigh speed transceiver package; Dielectric losses; Metals; Silicon; Substrates; Through-silicon vias; Transceivers;

机译：集成电路互连;集成电路封装;硅;收发器; SSIT;载波频率;互连损耗;毫米波域;无源互连创新;半导体IC封装;硅均衡;叠层硅集成技术;系统补偿方案;超高速收发器封装;电介质损耗;金属;硅;基板;直通硅通孔;收发器;

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专利

1. System-in-a-Package Integration of SAW RF Rx Filter Stacked on a Transceiver Chip [J] . Robert E. Jones, Chandra Ramiah, Telesphor Kamgaing, IEEE Transactions on Advanced Packaging . 2005,第2期

机译：收发器芯片上堆叠的SAW RF Rx滤波器的系统级集成
2. Agilent technologies' singlemode small form factor (SFF) moduleincorporates micromachined silicon, automated passive alignment, andnon-hermetic packaging to enable the next generation of low-cost fiberoptic transceivers [J] . Owen M. IEEE Transactions on Advanced Packaging . 2000,第2期

机译：安捷伦科技的单模小尺寸（SFF）模块结合了微加工硅，自动无源对准和非密封封装，可实现下一代低成本光纤收发器
3. Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers [J] . Owen M. IEEE Transactions on Advanced Packaging . 2000,第2期

机译：安捷伦科技的单模小尺寸（SFF）模块结合了微加工硅，自动无源对准和非密封包装，可实现下一代低成本光纤收发器
4. Ultrahigh speed transceiver package with stacked silicon integration technology [C] . Hong Shi IEEE Electronics Packaging Technology Conference . 2014

机译：超高速收发器包装堆叠硅集成技术
5. Design of high-speed silicon-germanium HBT circuits for wideband transceivers. [D] . Lu, Yuan. 2007

机译：宽带收发器的高速硅锗HBT电路设计。
6. Ultrahigh speed endoscopic optical coherence tomography using micromotor imaging catheter and VCSEL technology [O] . Tsung-Han Tsai, Benjamin Potsaid, Yuankai K. Tao, 2013

机译：使用微电机成像导管和VCSEL技术的超高速内窥镜光学相干断层扫描
7. 3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019) [O] . Xiaoxiang Wu, Haiguang Ma, Han Yin, 2019

机译：3D电子产品：3D侧壁集成超高密度硅纳米线用于堆叠通道电子（ADV。电子。Matter。7/2019）
8. Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments. [R] . Tabbert, C. 2016

机译：用于恶劣环境的芯片级封装光纤收发器集成。

Ultrahigh speed transceiver package with stacked silicon integration technology

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