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Photonic device package design, assembly and encapsulation

机译：光子器件封装设计，组装和封装

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Photonic devices like Optical transceivers, Solar cells, LED's (Light Emitting Diodes) etc, have been developed for high speed data communication, power generation and light sources. Photonics include, among others, emission, transmission, switching and sensing of light. GaAs and GaNi are examples of semiconductor materials used to create diodes, able to generate light. Different types of diodes can be made to generate light in the spectrum ranging from Ultra Violet via visible to Infra Red light. VCSEL's (Vertical Cavity Surface Emitting Laser diodes) can be used for data transmission via thin glass fiber cables and operate mainly at wave lengths around 850 nm. Photo diodes are used as light sensors and are able to receive data in the form of light pulses or modulated light. A photo diode is sensitive for photons striking the diode surface also known as the photo electric effect. When used for environment lightening, LED's can generate light in a variety of colors in the visible spectrum. Solar cells are light sensitive diodes used in a Photo Voltaic mode and able to convert sun light into electric energy. In most of these applications the diodes require a lens because the light is diffracted and a lens must be used to collimate the light. Due to their application and operating environment these diodes require a different assembly and packaging approach compared to conventional semiconductor devices. The focus of APC (Advanced Packaging Center) is on package design, process development for assembly and encapsulation of these types of devices and the generation of samples and low volume production quantities. The choice of package concept, lens parameters, assembly and encapsulation materials are of utmost importance for the functioning and reliability of the devices. For example the design of optical transceivers requires the package design to be such that no cross talk can take place between transmitter and receiver and the glass fiber cables can be connected - n a reliable way. To limit transmission losses, the assembly process requires high precision lens shapes and accurate placement of transmitter / receiver chips towards their lens centers. Encapsulation material properties like adhesion, transmittance, refractive index, CTE should be taken into account. Photonic devices are often subjected to extreme environments of radiation and heat and have to full fill a life time expectancy of 10 to 20 years.
机译：诸如光收发器，太阳能电池，LED（发光二极管）等光子器件已经开发用于高速数据通信，发电和光源。光子学尤其包括光的发射，传输，切换和感测。 GaAs和GaNi是用于制造能够产生光的二极管的半导体材料的示例。可以制造不同类型的二极管以产生光谱范围从紫外到可见光到红外光的光。 VCSEL（垂直腔表面发射激光二极管）可用于通过细玻璃纤维电缆进行数据传输，并且主要在850 nm左右的波长下工作。光电二极管用作光传感器，并能够以光脉冲或调制光的形式接收数据。光电二极管对撞击二极管表面的光子敏感，这也称为光电效应。当用于环境照明时，LED可以产生可见光谱中各种颜色的光。太阳能电池是在光伏模式下使用的光敏二极管，能够将太阳光转换成电能。在大多数这些应用中，二极管需要透镜，因为光会发生衍射，并且必须使用透镜来准直光。由于其应用和工作环境，与传统的半导体器件相比，这些二极管需要不同的组装和封装方法。 APC（高级包装中心）的重点是包装设计，这些类型设备的组装和封装的工艺开发以及样品的产生和小批量生产。封装概念，镜片参数，组装和封装材料的选择对于设备的功能和可靠性至关重要。例如，光收发器的设计要求其包装设计应确保发射器和接收器之间不会发生串扰，并且可以连接玻璃纤维电缆-这是一种可靠的方法。为了限制传输损耗，组装过程需要高精度的透镜形状以及将发射器/接收器芯片朝着其透镜中心的准确位置。应考虑到封装材料的性能，如附着力，透射率，折射率，CTE。光子器件通常要经受极端的辐射和热环境，并且必须充满10至20年的使用寿命。

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