Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

著录项

• 来源
  《IEEE Electronics Packaging Technology Conference》|2014年|438-443|共6页
• 会议地点
• 作者

  Jie Li Aw; Chow A.; Au K.Y.; Jong-Kai Lin;

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• 会议组织
• 原文格式 PDF
• 正文语种
• 中图分类
• 关键词

  assembling; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; tape automated bonding; BoM; CTE mismatch; TCB-NCP; assembly capability; assembly challenges; bare bondpads; bill of materials; coefficient of thermal expansion mismatch; flip chip joint fatigue life; nonconductive adhesive pillar microbumps; nonconductive paste; reliability assessment; silicon chip; solder cap volume effects; temperature cycling tests; thermal compression bonding; two-layer FCCSP organic substrate; ultra-fine pitch pillar flip chip interconnect; Bonding; Electronics packaging; Flip-chip devices; Joints; Silicon; Substrates;

  机译：装配;倒装芯片器件;集成电路互连;集成电路可靠性;胶带自动键合; BoM; CTE不匹配; TCB-NCP;装配能力;装配挑战;裸焊盘，材料清单;热膨胀系数不匹配;倒装芯片接头疲劳寿命;非导电胶柱微凸点;非导电胶;可靠性​​评估;硅芯片;焊锡帽体积效应;温度循环测试;热压键合;两层FCCSP有机基板;超细节距柱子倒装芯片互连;键合;电子封装;倒装芯片器件;接头;硅;基板;