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首页> 外文会议>IEEE Electronics Packaging Technology Conference >Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates
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Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

机译：Cu和Au / Ni金属化Cu基体上Sn-Ag-Cu基复合焊料的界面微观结构和剪切强度

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Nano-sized, non-reacting, non-coarsening CeO particles with a density close to that of solder alloy were incorporated into Sn-3.0wt%Ag-0.5wt%Cu solder paste. The interfacial microstructure and shear strength of Au/Ni metallized Cu substrates were investigated, as a function of aging time, at various temperatures. After solid state aging at low temperature, an island-shaped CuSn intermetallic compound (IMC) layer was found to be adhered at the interfaces of the Cu/Sn-Ag-Cu solder systems. However, after a prolonged aging, a very thin, firmly adhering CuSn IMC layer was observed between the CuSn IMC layer and the Cu substrate. On the other hand, a scallop-shaped (Cu, Ni)-Sn IMC layer was found at the interfaces of the Sn-Ag-Cu based solder-Au/Ni metallized Cu substrates. As the solid-state aging time and temperature increase, the thicknesses of the IMC layers also remarkably increased. In the solder ball region of both systems, a fine microstructure of AgSn and CuSn IMC particles appeared in the β-Sn matrix. However, the growth behavior of the IMC layers of composite solders doped with CeO nanoparticles was inhibited, due to an accumulation of surface-active CeO nanoparticles at the grain boundary or in the IMC layers. In addition, the composite solder joints doped with CeO nanoparticles had higher shear strengths than that of the plain Sn-Ag-Cu solder joints, due to a well-controlled fine IMC particles and uniformly distributed CeO nanoparticles.
机译：在Sn-3.0wt％Ag-0.5wt％Cu焊膏中掺入了纳米尺寸，不反应，不粗化的CeO颗粒，其密度接近于焊料合金的密度。研究了在不同温度下，Au / Ni金属化Cu基体的界面微观结构和剪切强度与时效时间的关系。在低温下进行固态老化后，发现岛状的CuSn金属间化合物（IMC）层粘附在Cu / Sn-Ag-Cu焊料系统的界面处。然而，在长时间的老化之后，在CuSn IMC层和Cu基板之间观察到非常薄且牢固粘附的CuSn IMC层。另一方面，在基于Sn-Ag-Cu的焊料-Au / Ni金属化Cu基板的界面处发现了扇贝形（Cu，Ni）-Sn IMC层。随着固态老化时间和温度的增加，IMC层的厚度也显着增加。在这两个系统的焊球区域中，β-Sn基质中均出现了AgSn和CuSn IMC颗粒的精细微观结构。然而，由于表面活性的CeO纳米颗粒在晶界或在IMC层中的积累，抑制了掺有CeO纳米颗粒的复合焊料的IMC层的生长行为。另外，由于很好地控制了细的IMC颗粒和均匀分布的CeO纳米颗粒，掺杂有CeO纳米颗粒的复合焊点的剪切强度比普通的Sn-Ag-Cu焊点高。

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