首页> 外文会议>Conference on photomask and next-generation lithography mask technology >Improvement of the resolution and accuracy of chemical-amplification positive resist for 0.13 mu m-reticle fabrication
【24h】

Improvement of the resolution and accuracy of chemical-amplification positive resist for 0.13 mu m-reticle fabrication

机译:改善化学扩增抗蚀剂的分辨率和精度为0.13μm-kclicle制造

获取原文

摘要

We have developed a novolak-based chemical-amplification resist for 0.13- mu m or later reticle fabrication. For the 0.13- mu m or later design-rule reticle-fabrication with OPC patterns, the resist resolution is required under 0.2- mu m on the mask substrate. To improve the chemical-amplification resist resolution, it is necessary to control the acid-diffusion in the resist film. We have developed the technique of the acid-diffusion control with neutral-salt additives. By use of the resist ith this technique, we could fabricate 0.14- mu m 1/s patterns on a CrOx substrate at a dose of 9.3- mu C/cm~2 (50kV). The resist has a good margin of doses.
机译:我们开发了基于酚醛清漆的化学抗蚀剂,用于0.13 - MU M或更高版本的掩模版制造。对于0.13 - MU M或更高版本的设计规则 - 用OPC图案制造,在掩模基板上的0.2-μm下需要抗蚀剂分辨率。为了提高化学抗蚀剂分辨率,有必要控制抗蚀剂膜中的酸扩散。我们开发了中性盐添加剂的酸扩散控制技术。通过使用该技术的抗蚀剂,我们可以以9.3-mu C / cm〜2(50kV)的剂量在克鲁克底物上制造0.14-μm1/ s的图案。抗蚀剂具有良好的剂量余量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号