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Atmospheric pressure chemical vapor deposition of silicon thin films using cyclohexasilane

机译:使用环己硅烷的大气压化学气相沉积硅薄膜

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We report the deposition of silicon thin films at high rates using atmospheric pressure chemical vapor deposition (AP-CVD) with cyclohexasilane (CHS), a liquid-hydrosilane. A precursor solution of CHS in cyclooctane was aerosolized and subsequently vaporized prior to contacting with the substrate. Using CHS, Si thin films were obtained at temperatures as low as 300 °C. A deposition rate of ∼50 nm/s was observed at 500 °C; while good-quality Si films were realized at 400 °C. Structural analysis of the films indicates a combination of amorphous and nano-crystalline Si phases, withe 2–3 orders of photoconductivity.
机译:我们报告使用大气压化学气相沉积(AP-CVD)和液态六氢硅烷环己硅烷(CHS)以高速率沉积硅薄膜。在与基材接触之前,先气化CHS在环辛烷中的前体溶液,然后蒸发。使用CHS,可在低至300°C的温度下获得Si薄膜。在500°C下观察到约50 nm / s的沉积速率;而在400°C时可获得高质量的Si膜。薄膜的结构分析表明,非晶态和纳米晶态的硅相结合在一起,具有2-3个数量级的光电导率。

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