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A TSV repair method for clustered faults

机译：集群故障的TSV修复方法

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摘要

Three-dimensional integrated circuits (3D-ICs) using Through-silicon Vias (TSVs) allow the stacking multiple dies to manufacture chips with many benefits, such as high density and high bandwidth. Unfortunately, the yield of 3D dies, stacking with a large number of TSVs is significantly impacted by the reliability of TSVs. In order to improve the yield of 3D-ICs, TSVs must be reparable. In practice, the faulty TSVs may cluster because of the imperfect bonding quality of TSVs. A right trapezoidal grouping based method was proposed to repair clustered faulty TSVs in this paper. Experimental results show that the yield of the proposed method is 99.80% with 50% area reduction compared to that of the router-based method.
机译：使用硅通孔（TSV）的三维集成电路（3D-IC）允许堆叠多个管芯来制造具有许多优势（例如高密度和高带宽）的芯片。不幸的是，与大量TSV堆叠的3D模具的良率受到TSV可靠性的显着影响。为了提高3D-IC的产量，TSV必须是可修复的。实际上，由于TSV的键合质量不理想，有缺陷的TSV可能会聚集。提出了一种基于梯形分组的方法来修复簇状故障TSV。实验结果表明，与基于路由器的方法相比，该方法的产率为99.80％，面积减少了50％。

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