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首页> 外文会议>Annual SEMI Advanced Semiconductor Manufacturing Conference >Bridging the gap - integrating APC constraints and WIP flow optimization to enhance automated decision making in semiconductor manufacturing
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Bridging the gap - integrating APC constraints and WIP flow optimization to enhance automated decision making in semiconductor manufacturing

机译：缩小差距-整合APC约束和WIP流程优化以增强半导体制造中的自动化决策

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摘要

Advanced process control (APC) is widely used in semiconductor manufacturing to adjust process parameters, ensuring a high product quality, while WIP flow optimization systems for scheduling & dispatching make decisions by assigning lots to tools for processing. APC imposes additional constraints to the operational decisions. It is critical to understand the relationship between these two aspects of the semiconductor manufacturing process in order to make better decisions for both. As this is a pressing and compelling topic for researchers and practitioners, this paper presents an integration approach that connects APC and WIP flow optimization systems, allowing APC aspects to be incorporated into scheduling & dispatching, in order to balance the conflict between product quality and operational objectives.
机译：先进的过程控制（APC）在半导体制造中广泛用于调整过程参数，以确保高质量的产品，而用于计划和调度的WIP流程优化系统则通过为加工工具分配批次来做出决策。 APC对操作决策施加了额外的约束。了解半导体制造过程的这两个方面之间的关系，以便为两者做出更好的决定，这一点至关重要。由于这是研究人员和从业人员一个紧迫而引人注目的主题，因此本文提出了一种将APC和WIP流程优化系统连接起来的集成方法，允许将APC方面纳入调度和调度中，以平衡产品质量与运营之间的冲突。目标。

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