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Challenges in integrating embedded non volatile memory with floating poly and ONO in base line process

机译:在基线过程中将嵌入式非易失性存储器与浮动poly和ONO集成的挑战

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This paper discuss the challenges of the integration of non volatile memory array in base line CMOS technology. Process modules of Oxide-Nitride-Oxide (ONO) and floating poly are reviewed with specific examples. This integration work resulted in a successful production line with a path for additional integration of high power LDMOS devices with deep trench isolation (DTI).
机译:本文讨论了将非易失性存储器阵列集成到基线CMOS技术中所面临的挑战。通过具体示例对氧化物-氮化物-氧化物(ONO)和浮法多晶硅的工艺模块进行了综述。这项集成工作导致了一条成功的生产线,并为高功率LDMOS器件与深沟槽隔离(DTI)的进一步集成铺平了道路。

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