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Effect of top corner rounding in BEOL to yield in advanced technologies

机译：BEOL的上角四舍五入对先进技术产量的影响

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摘要

In advanced technologies as the dimensions shrink, even the slight change in profiles can cause issues in BEOL integration. This paper discusses the effect of dielectric profile on product yield. Even though these issues were not seen on standard monitoring structures, the issue has been observed in products of very complicated design structures. The yield losses for this failure mechanism range from 10% to 20%. The fails being more of a functional fail than a physical failure made the problem even more complicated. Here we discuss how the issue was identified by data mining, followed by in depth investigation on individual module and understanding the interactions. By understanding the interaction between process modules, an optimized and manufacturable solution was derived and implemented. The issue was addressed by optimizing the film treatment and the wet-clean optimization, as an integrated module approach. Yield was verified on this optimized process and proven.
机译：在先进技术中，随着尺寸的缩小，即使轮廓的微小变化也可能导致BEOL集成出现问题。本文讨论了介电分布对产品成品率的影响。即使在标准的监视结构中未发现这些问题，也已在非常复杂的设计结构的产品中发现了此问题。该故障机制的成品率损失在10％至20％的范围内。与物理故障相比，故障更多是功能故障，使问题更加复杂。在这里，我们讨论如何通过数据挖掘来识别问题，然后对各个模块进行深入调查并理解交互作用。通过了解过程模块之间的相互作用，得出并实现了一种优化且可制造的解决方案。通过优化薄膜处理和湿法清洁（作为集成模块方法）解决了该问题。通过此优化过程验证并证明了产量。

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