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首页> 外文会议>IEEE Electronic Components and Technology Conference >First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly
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First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly

机译：首次展示了带有双面组件的超薄3D玻璃中介层中的镀铜直通封装（TPV）可靠性

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This paper reports the first reliability demonstration of copper-plated laser-drilled through-package-vias (TPV) in ultra-thin 3D glass interposers with double-side component assembly. This was accomplished with four major innovations: 1) TPV geometry design for low stress, 2) fabrication of TPV with minimum defects, 3) interconnection and assembly process development, and 4) package design for minimal warpage during assembly and thermal cycling test (TCT). Finite element models were used to obtain design guidelines for reliability and estimate critical regions of the 3D package during thermal cycling. Following the design guidelines from modelling, 6`×6' glass interposer panels of 100μm thickness were fabricated with TPVs. Vias were formed with 355nm UV laser at 60μm diameter. Test dies were assembled on both sides and connected with TPVs. Distance between the solder bump of test die and TPV was varied in order to assess its effect on reliability. Additionally, TPV daisy-chain coupons without dies were fabricated to investigate the reliability of UV laser drilled TPVs in free-standing glass. Test coupons were subjected to liquid-to-liquid thermal cycling test between 125°C and -40°C with 5 minutes dwell time at each temperature extremes. All TPV daisy-chains in free-standing glass and all double-side assembly coupons passed 1000 thermal cycles. Further thermal cycling up to 2000 thermal cycles resulted in failures related to solder bump-glass interposer connection. There were no failures in TPV chain in both free-standing and double-side die assembled test coupons as was predicted by simulations.
机译：本文首次报道了在带有双面组件的超薄3D玻璃中介层中镀铜的激光钻孔直通封装通孔（TPV）。这是通过以下四个主要创新完成的：1）用于低应力的TPV几何设计，2）具有最小缺陷的TPV的制造，3）互连和组装工艺的开发以及4）封装设计，用于在组装和热循环测试（TCT）时将翘曲最小化）。有限元模型用于获得可靠性的设计准则，并在热循环过程中估算3D封装的关键区域。遵循建模的设计准则，使用TPV制作了厚度为100μm的6`×6'玻璃中介层板。用直径为60μm的355nm UV激光器形成通孔。测试模具在两侧组装，并与TPV连接。为了评估其对可靠性的影响，改变了测试管芯的焊料凸点和TPV之间的距离。此外，制造了无模具的TPV菊花链试样，以研究独立式玻璃中UV激光钻孔的TPV的可靠性。在125°C至-40°C的温度范围内，在5分钟的停留时间下对测试试样进行液-液热循环测试。独立玻璃中的所有TPV菊花链和所有双面组装试样均经过1000次热循环。进一步的热循环（直至2000个热循环）导致与焊料凸块-玻璃中介层连接有关的故障。正如仿真所预测的那样，在独立式和双面模具组装的测试样张中，TPV链均无故障。

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