Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials

机译：超细双金属Ag-Cu纳米颗粒作为芯片附着材料的合成与表征

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In this paper, we propose an facile one-step reduction approach free of microwave-assisted heating or water-bath heating to synthesize Ag-Cu nanoparticles (NPs). Results showed that fcc Ag-Cu NPs with an ultra-fine average size of 9 nm were achieved and expected to sinter at about 330°C which is much lower than the eutectic temperature of bulk Ag-Cu alloy (779°C) according to the analysis of TG/DSC. This study provided a new SiC die attach materials with good properties at high temperature.

机译：在本文中，我们提出了一种简便的一步还原方法，该方法无需微波辅助加热或水浴加热即可合成Ag-Cu纳米颗粒（NPs）。结果表明，实现了超细平均尺寸为9 nm的fcc Ag-Cu NP，并预计在约330°C烧结，这远低于块状Ag-Cu合金的共晶温度（779°C）。 TG / DSC的分析。这项研究提供了一种在高温下具有良好性能的新型SiC芯片连接材料。

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《International Conference on Electronic Packaging Technology》|2016年|206-208|共3页
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Xiaojian Liu; Chunqing Wang; Zhen Zheng; Wei Liu;
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Heating; Magnetic resonance imaging; Silicon;

机译：加热;磁共振成像;硅;

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4. Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials [C] . Xiaojian Liu, Chunqing Wang, Zhen Zheng, International Conference on Electronic Packaging Technology . 2016

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Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials

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