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Impack of crosstalk on signal integrity of high density ceramic package for IC

机译：串扰对用于IC的高密度陶瓷封装的信号完整性的影响

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With the rapid development of high density packaging technology, signal integrity of packages has become a hot research field. The signal integrity related problems, including noises (Delay, Reflection, Crosstalk between different line, etc.), bus timing design and power integrity issues, may seriously affect the performance of whole electronic system and even cause this system fail to work. This article is based on basic theory of the signal integrity at high - speed circuit transmission line, use the method of test and simulation to study the near-end crosstalk and far-end crosstalk among signal lines. Test and analysis the crosstalk at large scale integrated circuit package CQFP240M. Build micro-strip line and strip-line model through simulation software, to simulate and test the influence factors of crosstalk between adjacent transmission lines. And put forward crosstalk reduction method and optimized design rule according to the simulation results.
机译：随着高密度包装技术的飞速发展，包装的信号完整性已成为研究的热点。与信号完整性相关的问题，包括噪声（延迟，反射，不同线路之间的串扰等），总线时序设计和电源完整性问题，可能会严重影响整个电子系统的性能，甚至导致该系统无法正常工作。本文基于高速电路传输线信号完整性的基本理论，采用测试和仿真方法研究信号线之间的近端串扰和远端串扰。在大规模集成电路封装CQFP240M上测试和分析串扰。通过仿真软件建立微带线和带状线模型，对相邻传输线之间的串扰影响因素进行仿真和测试。并根据仿真结果提出了降低串扰的方法和优化的设计规则。

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