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Mathematical modelling of coupled heat and mass transport into an electronic enclosure

机译：传热和传质耦合到电子外壳的数学模型

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In contrast to high fidelity CFD codes which require higher computational effort/time, the well-known Resistor-Capacitor (RC) approach requires much lower calculation time, but also with a lower resolution of the geometrical arrangement. Therefore, for enclosures without too complex geometry in their interior, it is more efficient to use the RC method for thermal management and design of electronic compartments. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure. The developed code has the capability of combining lumped components and a 1D description. Heat and mass transport is based on a FVM discretization of the heat conduction equation and Fick's second law. Simulation results are compared with corresponding experimental findings and good agreement is found. Second simulation was performed to study the response of temperature and moisture inside an enclosure exposed to the B2 STANAG climatic cyclic conditions.
机译：与需要较高的计算工作量/时间的高保真CFD代码相比，众所周知的电阻电容（RC）方法所需的计算时间要少得多，而且几何排列的分辨率也较低。因此，对于内部几何形状不太复杂的外壳，将RC方法用于电子隔间的热管理和设计会更有效。因此，本文的目的是基于RC方法构建内部代码，以模拟耦合的热量和质量传递到（封闭的）电子外壳中。开发的代码具有合并集总组件和一维描述的功能。传热和传质基于热传导方程的FVM离散化和菲克第二定律。仿真结果与相应的实验结果进行了比较，发现吻合良好。进行了第二次模拟，以研究暴露于B2 STANAG气候循环条件下的机柜内温度和湿度的响应。

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