An image sensor/processor 3D stacked module featuring ThruChip interfaces

机译：具有ThruChip接口的图像传感器/处理器3D堆叠模块

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摘要

A 1,000-fps motion vector (MV) estimation and classification engine for high-speed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled and tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient MV estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.

机译：提出，原型，组装和测试了用于3D堆叠成像器/处理器模块中的高速计算成像的1,000 fps运动矢量（MV）估计和分类引擎。该模块具有以下特点：1）用于高fps图像传输的ThruChip接口; 2）与传统的相比，面积/功率有效的MV估计架构多几个数量级; 3）MV模式上采用的认知分类方案，可对运动对象进行分类常规建议中可能的。

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《Asia and South Pacific Design Automation Conference》|2017年|7-8|共2页
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Masayuki Ikebe; Tetsuya Asai; Masafumi Mori; Toshiyuki Itou; Daisuke Uchida; Yasuhiro Take; Tadahiro Kuroda; Masato Motomura;
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Imaging; Feature extraction; Three-dimensional displays; Iron; Estimation; System-on-chip; Ports (Computers);

机译：成像;特征提取;三维显示器;铁;估计;片上系统;端口（计算机）;

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专利

1. Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface [J] . Akio Nomura, Yusuke Matsushita, Junichiro Kadomoto, International Journal of Networking and Computing . 2018,第1期

机译：具有电感耦合直通芯片接口的3D芯片堆栈的自动扶梯网络
2. Proposal of stacked type Fe-FET reconfigurable logic circuit featured with parallel processing within one silicon pillar using modified process technology of 3D NAND flash memory [J] . Tomohiro Yokota, Shigeyoshi Watanabe Contemporary Engineering Sciences . 2018,第17a20期

机译：建议使用3D NAND闪存的改进工艺技术在一个硅柱内进行并行处理的堆叠式Fe-FET可重构逻辑电路
3. An Image Inpainting Method for Interleaved 3D Stacked Image Sensor [J] . Gao Jing, Zhu Jingyu, Nie Kaiming, IEEE sensors journal . 2019,第24期

机译：交错3D堆叠图像传感器的图像初始化方法
4. An image sensor/processor 3D stacked module featuring ThruChip interfaces [C] . Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Asia and South Pacific Design Automation Conference . 2017

机译：图像传感器/处理器3D堆叠模块，具有Thruchip接口
5. Cooling Strategy for Effective Automotive Power Trains: 3D Thermal Modeling and Multi-Faceted Approach for Integrating Thermoelectric Modules into Proton Exchange Membrane Fuel Cell Stack. [D] . Ramani, Dilip. 2014

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6. A 12-Gb/s Stacked Dual-Channel Interface for CMOS Image Sensor Systems [O] . Sang-Hoon Kim, Hoon Shin, Youngkyun Jeong, 2018

机译：用于CMOS图像传感器系统的12 Gb / s堆叠双通道接口
7. Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface [O] . Akio Nomura, Yusuke Matsushita, Junichiro Kadomoto, 2018

机译：用于3D芯片堆栈的自动扶梯网络与电感耦合Thruchip接口

An image sensor/processor 3D stacked module featuring ThruChip interfaces

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