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首页> 外文会议>IEEE Electronic Components and Technology Conference >A Study on the Fabrication of Electrical Circuits on Fabrics Using Cu Pattern Laminated B-Stage Adhesive Films for Electronic Textile Applications
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A Study on the Fabrication of Electrical Circuits on Fabrics Using Cu Pattern Laminated B-Stage Adhesive Films for Electronic Textile Applications

机译：用于电子纺织应用的铜图案层压B阶段胶膜在织物上制造电路的研究

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摘要

In this study, fabrication of the metal circuits on fabrics was demonstrated by a novel lamination method using B-stage epoxy adhesive films with patterned metals. Copper foils were firstly attached to the B-stage adhesive films, and copper was patterned by conventional photolithography methods. And then the patterned Cu/adhesive films were laminated onto conventional cloth or fabric using a vacuum lamination method. First, the effects of lithography processes on the chemical stability of uncured epoxy adhesive films were investigated. Morphology of Cu/fabric structures was observed by optical microscope (OM) and scanning electron microscope (SEM). Furthermore, mechanical flexibility of the laminated Cu lines on fabrics were evaluated by a dynamic bending fatigue test. By optimizing adhesive curing properties and processes, patterned metal circuits on fabrics were successfully demonstrated for electronic textile applications.
机译：在这项研究中，通过一种新颖的层压方法来证明在织物上制造金属电路的方法，该方法是使用带有图案化金属的B级环氧胶粘剂薄膜。首先将铜箔贴到B级粘合膜上，然后通过常规的光刻方法对铜进行构图。然后，使用真空层压方法将图案化的Cu /粘合剂膜层压到常规的布或织物上。首先，研究了光刻工艺对未固化环氧胶膜化学稳定性的影响。通过光学显微镜（OM）和扫描电子显微镜（SEM）观察Cu /织物结构的形态。此外，通过动态弯曲疲劳试验评价了织物上的层压铜线的机械柔韧性。通过优化粘合剂的固化性能和工艺，成功地证明了织物上的图案化金属电路可用于电子纺织应用。

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