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Curved Full-Frame CMOS Sensor: Impact on Electro-Optical Performances

机译：弯曲全画幅CMOS传感器：对光电性能的影响

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Optical designs generate curved focal planes for which field flatteners must be implemented. A field flattener consists of an additional lenses block with a consequent loss of throughput and performances. With the recent packaging development for curved sensors, this can be omitted and the optical system simplified. In this paper, we first describe advantages of curved sensors and associated packaging process fabrication, applied on a full-frame format 20Mpx global shutter CMOS image sensor (AMS CMV20000 product). Mechanical limits for curving such full-frame sensor type are discussed, using Finite Element Modelling to manage die breaks. We have curved sensors with a spherical shape from concave Rc=150mm to convex Rc=280mm. We packaged them into their ceramic package and we carried out electro-optical characterization, in collaboration with the AMS CIS characterization team. The electro-optical performances of the curved sensors are investigated and the results compared to the datasheet. We mainly focus on response uniformity, dark noise and dark current results. We present those characteristics in the form of mappings in order to investigate any impact of curvature process on image sensor performances. All these experiments and their electro-optical results demonstrate the feasibility of curving full-frame image sensor with only small electro-optical parameter shift compared to a typical flat reference.
机译：光学设计会生成弯曲的焦平面，必须对其实施场平坦化。场平整机由一个附加的镜头块组成，因此会损失吞吐量和性能。随着最近用于弯曲传感器的包装开发，可以省去这一点并简化光学系统。在本文中，我们首先描述了在全帧格式20Mpx全局快门CMOS图像传感器（AMS CMV20000产品）上应用的弯曲传感器和相关封装工艺制造的优势。使用有限元建模来管理模具断裂，讨论了弯曲此类全画幅传感器类型的机械极限。我们提供了从凹形Rc = 150mm到凸形Rc = 280mm的球形弯曲传感器。我们将它们包装到陶瓷封装中，并与AMS CIS表征​​团队合作进行了电光表征。研究了弯曲传感器的电光性能，并将结果与​​数据表进行了比较。我们主要关注响应均匀性，暗噪声和暗电流结果。我们以映射的形式呈现这些特征，以调查曲率过程对图像传感器性能的任何影响。所有这些实验及其电光结果表明，与典型的平面基准相比，仅用很小的电光参数偏移即可弯曲全帧图像传感器的可行性。

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