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首页> 外文会议>ASME international conference on nanochannels, microchannels and minichannels >TWO-PHASE FLOW CONJUGATE HEAT TRANSFER IN WAVY MICROCHANNEL
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TWO-PHASE FLOW CONJUGATE HEAT TRANSFER IN WAVY MICROCHANNEL

机译：波浪形微通道中的两相流共轭传热

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摘要

Flow boiling in microchannel heat sink offers an effective cooling solution for high power density micro devices. A three-dimensional numerical study based on volume of fraction model (VOF) coupled with evaporation condensation model accounting for the liquid-vapor phase change is undertaken to recreate vapor bubble formation in saturated flow boiling in wavy microchannel. Constant wall heat flux imposed at the bottom surface of the substrate while other faces are insulated. To understand the conjugate effects, simulations has been carried out for substrate thickness to channel depth ratio (δ_(sf) ～ 1-5), substrate wall to fluid thermal conductivity ratio (k_(sf) ～ 22 - 300) and waviness (γ ～ 0.008 -0.04). Bubble nucleation, growth, and departure of bubble plays a significant role in heat transfer and pressure drop characteristics in two-phase flow in wavy microchannel. The coolant (water) temperature at the inlet is taken to be 373 K while flow was at atmospheric pressure. This makes shorter waiting period of bubble nucleation, and the number density of bubbles on the solid surface increases. This results in enhancement of the boiling effect, and thus with the presence of bubbles, the mixing of laminar boundary layers improves and enhances the overall heat transfer coefficient. Channel amplitude play an important factor that can suitably reduce the friction factor and enhances the heat transfer coefficient.
机译：微通道散热器中的流动沸腾为高功率密度的微型设备提供了有效的冷却解决方案。基于分数体积模型（VOF）结合蒸发冷凝模型解决了液-汽相变问题，进行了三维数值研究，以再现波浪状微通道中饱和流动沸腾中的汽泡形成。恒定的壁热通量施加在基板的底面，而其他面则被绝缘。为了理解共轭效应，对基板厚度与通道深度之比（δ_（sf）〜1-5），基板壁与流体热导率之比（k_（sf）〜22-300）和波纹度（γ）进行了仿真。 〜0.008 -0.04）。波浪形微通道中两相流中气泡的成核，气泡的生长和离开在传热和压降特性中起着重要作用。当流量为大气压时，入口处的冷却剂（水）温度为373K。这使得气泡成核的等待时间更短，并且固体表面上气泡的数量密度增加。这导致沸腾效果的增强，因此，在气泡的存在下，层状边界层的混合得以改善并提高了总的传热系数。通道振幅起着重要的作用，可以适当降低摩擦系数并提高传热系数。

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