首页> 外文会议>ASME international conference on nanochannels, microchannels and minichannels >IMPROVING LIQUID SUPPLY PATHWAYS ON GRAPHENE OXIDE COATED SURFACES FOR ENHANCED POOL BOILING HEAT TRANSFER PERFORMANCE
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IMPROVING LIQUID SUPPLY PATHWAYS ON GRAPHENE OXIDE COATED SURFACES FOR ENHANCED POOL BOILING HEAT TRANSFER PERFORMANCE

机译:改善氧化石墨烯涂层表面上的液体供应途径,以增强池沸腾传热性能

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Graphene is a two-dimensional material that possesses excellent thermal properties and thus has gained an enormous attention in the applications of heat transfer. In this work, we demonstrate the enhancement of boiling heat transfer performance on substrate coated with graphene oxide and/or copper composites. The graphene oxide and/or copper composites were introduced on the substrate by two commonly used coating techniques - dip-coating and a two-step electrochemical deposition method. The focus of this paper is to compare the morphologies, surface properties such as wickability and porosity rendered by these coating methods and compare the resultant heat transfer coefficients and critical heat fluxes. The surfaces were characterized by Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), and Fourier Transform Infrared (FTIR) techniques. Critical Heat Flux of 220 W/cm~2 at the wall superheat of 14.8°C was achieved for the highest 2.5% GO-Cu electrodeposited chip, while CHF of 128 W/cm~2 at the wall superheat of 13.2°C was achieved for the 5 minutes dip coated test surface.
机译:石墨烯是具有优异热性能的二维材料,因此在传热应用中引起了极大的关注。在这项工作中,我们证明了在涂有氧化石墨烯和/或铜复合材料的基材上沸腾传热性能的增强。通过两种常用的涂覆技术-浸涂和两步电化学沉积法将氧化石墨烯和/或铜复合材料引入到基材上。本文的重点是比较这些涂覆方法产生的形貌,表面特性(如芯吸性和孔隙率),并比较由此产生的传热系数和临界热通量。通过扫描电子显微镜(SEM),X射线衍射(XRD)和傅立叶变换红外(FTIR)技术对表面进行了表征。对于最高2.5%的GO-Cu电沉积芯片,在14.8°C的壁过热条件下达到220 W / cm〜2的临界热通量,而在13.2°C的壁过热条件下实现CHF为128 W / cm〜2的临界热通量。 5分钟浸涂测试表面。

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