Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3system

机译：基于硼硅酸盐玻璃/ Al 2 O 3 系统的镍金可镀层LTCC基底的制备与表征

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Borosilicate glass with the additions of Al2O3(40~55%) composites were sintered at 850°C. Different qualitative and quantitative instruments were used to employ the influence mechanism of the different Al2O3contents on the properties of the composites. Composites with 45wt% Al2O3sintered at 850°C presented great performance: the bulk density of 2.51 g/cm³, the dielectric constant of 5.27 and the dielectric loss of 0.0027 at 1 MHz, the thermal expansion coefficient of 5.79*10⁻⁶ppm/°C, the flexural strength of 142.5MPa and the weight loss of 2.78 mg/cm²after soaking in 1 mol/L nitric acid Solution. The composite could meet the shrinkage requirement of Ag electrodes and could not possibly react with Ag electrodes any more. The metallized substrate can withstand the electroless nickel immersion gold process.

机译：含铝硼硅酸盐玻璃 2 Ø 3 （40〜55％）复合材料在850℃下烧结。使用不同的定性和定量手段来利用不同铝的影响机理 2 Ø 3 含量对复合材料性能的影响。铝含量为45wt％的复合材料 2 Ø 3 在850°C的温度下烧结表现出出色的性能：堆积密度为2.51 g / cm ^{3
，介电常数为5.27，在1 MHz时的介电损耗为0.0027，热膨胀系数为5.79 * 10
^{-6
ppm /°C，抗弯强度为142.5MPa，重量损失为2.78 mg / cm
^{2
在1 mol / L硝酸溶液中浸泡后。该复合材料可以满足Ag电极的收缩要求，并且不再可能与Ag电极反应。金属化的基板可以承受化学镀镍浸金工艺。}}}

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《International Conference on Electronic Packaging Technology》|2018年|1649-1652|共4页
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Wan huanhuan; Zhang weijun; Liu zhuofeng;
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Substrates; Aluminum oxide; Dielectrics; Electrodes; Ceramics; Plating; Glass;

机译：基材;氧化铝;电介质;电极;陶瓷;电镀;玻璃;

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5. Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3system [C] . Wan huanhuan, Zhang weijun, Liu zhuofeng International Conference on Electronic Packaging Technology . 2018

机译：基于硼硅酸盐玻璃/ Al 2 3 系统的镍 - 金板LTCC基板的制造与表征。
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Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3system

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