• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International Symposium on Power Semiconductor Devices and IC's >Accelerated thermal fatigue test of metallized ceramic substrates for SiC power modules by repeated four-point bending
【24h】

Accelerated thermal fatigue test of metallized ceramic substrates for SiC power modules by repeated four-point bending

机译：通过反复四点弯曲加速用于SiC功率模块的金属化陶瓷基板的热疲劳试验

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Maximum tensile stress in the ceramics during thermal cycle test (from -40 to 250°C) of active metal brazing (AMB) substrate was estimated by the finite element method (FEM) analysis, because such a tensile stress is the driving force of Cu plate delamination from the ceramic plate. In order to accelerate thermal fatigue of the AMB substrate, tensile stress 1.5-2.1 times larger than the maximum thermal stress at -40°C was applied to ceramic plate by four-point bending the AMB substrate at 250°C repeatedly at a frequency of 1 Hz. The time to failure by repeated bending of the SÌ3N4-AMB substrate was less than 1/40 of the time to delamination of the Cu plate by the thermal cycling.
机译：通过有限元方法（FEM）分析来估算活性金属钎焊（AMB）基板在热循环测试（-40至250°C）期间陶瓷中的最大拉应力，因为这种拉应力是Cu的驱动力陶瓷板与陶瓷板的分层。为了加速AMB基板的热疲劳，通过在250°C下重复四点弯曲AMB基板于250°C的频率，向陶瓷板施加比-40°C时的最大热应力大1.5-2.1倍的拉伸应力。 1赫兹S repeated反复弯曲导致失效的时间 3 ñ 4 -AMB衬底小于通过热循环使Cu板分层的时间的1/40。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号