Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics

机译：用SiC半导体对Ag烧结接头的可靠性评估及其在电力电子领域的失效机理确定。

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Sintered Ag (SAG) is nowadays used for die attach in field of automotive power electronics. Nevertheless, failure mechanisms in this porous layer under different loading conditions are not completely understood yet. Different joined materials like SiC (di

机译：如今，烧结银（SAG）已用于汽车电力电子领域的芯片贴装。然而，该多孔层在不同载荷条件下的破坏机理尚未完全理解。 SiC（di

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|1-12|共12页
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Marco Schaal; Markus Klingler; Benjamin Metais; Ralph Grüninger; Stefan Hoffmann; Bernhard Wunderle;
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Failure analysis; Silicon carbide; Strain; Plastics; Temperature distribution; Microassembly;

机译：失效分析;碳化硅;应变;塑料;温度分布;微装配;

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1. Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors [J] . Vahid Samavatian, Hossein Iman-Eini, Yvan Avenas, IEEE Transactions on Power Electronics . 2020,第9期

机译：蠕变失效机制对功率半导体焊点热机械可靠性的影响
2. Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging [J] . Gang Chen, Lin Yu, Yun-Hui Mei, Journal of Materials Processing Technology . 2014,第9期

机译：电力电子封装用SAC305接头和纳米银烧结接头在高温下的可靠性比较
3. Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging [J] . IEEE transactions on device and materials reliability . 2014,第1期

机译：快速电流辅助方法在功率电子封装中表征纳米烧结银接头及其可靠性
4. Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics [C] . Marco Schaal, Markus Klingler, Benjamin Metais, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：AG烧结接头的可靠性评估使用SIC半导体和电力电子领域的故障机制测定
5. A new reliability assessment model for power electronic modules considering failure mechanism interaction. [D] . Zhuang, Xing. 2015

机译：考虑故障机制相互作用的电力电子模块可靠性评估模型。
6. Fundamental research on semiconductor SiC and its applications to power electronics [O] . Hiroyuki MATSUNAMI 2020

机译：半导体SIC及其在电力电子产品中的基础研究
7. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications [O] . John D. Sørensen, Erik E. Kostandyan 2011

机译：风力机应用中裂纹损伤模型的电力电子模块焊点可靠性评估

Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics

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