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首页> 外文会议>Electronics and the Environment, 1994. ISEE 1994. Proceedings., 1994 IEEE International Symposium on >Fluid head-source reduction process technology
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Fluid head-source reduction process technology

机译：减少流体头源工艺技术

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摘要

The fluid head is an exciting new technology developed at IBM Endicott. It is based on the fluid bearing principle, where small volumes of high speed fluid, hold and support and process a panel. This process is confined very close to the product and is able to deliver controlled amounts of fluids resulting in: less water usage; emission reduction; better chemical containment; reduced atomization; less hazardous waste; and less energy consumption. In this paper, comparisons of equipment utilizing the fluid head in rinsing, and drying devices are compared with conventional dip and spray processes. Parameters of ionic contamination, debris removal, electrical usage, as well as water usage and reduction in floor space are compared.
机译：流体头是IBM Endicott开发的一项令人兴奋的新技术。它基于流体轴承原理，在此原理下，少量的高速流体可容纳，支撑和处理面板。该过程被限制在非常接近产品的位置，并且能够输送受控量的流体，从而导致：用水量减少;减排;更好的化学密闭性;减少雾化;减少有害废物;并减少能源消耗。在本文中，将在冲洗中使用流体头的设备与干燥设备的比较与传统的浸涂和喷涂工艺进行了比较。比较了离子污染，去除杂物，用电，用水和减少占地面积的参数。

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