LASER ULTRASOUND: AN INSPECTION TOOL OF SOFT POROUS LOW-DIELECTRIC CONSTANT FILMS FOR MICROELECTRONIC INTERCONNECT

机译：激光超声：用于微电子互连的软多孔低介电常数薄膜检测工具

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The demand for miniaturization in the microelectronics industry requires that the RC (Resistance-Capacitance) factor be lowered to reduce interconnection delay, crosstalk and power loss. The most promising way to achieve this is by introducing porosity into the dielectric film material. We show that laser-generated surface acoustic waves can successfully and rapidly characterize porosity/density and stiffness of these films. Complementary measurements from X-ray reflectivity and Brillouin light scattering verify our results. We discuss why nanoindentation presents difficulties.

机译：微电子行业对微型化的需求要求降低RC（电阻-电容）因数，以减少互连延迟，串扰和功率损耗。实现此目的的最有前途的方法是将孔隙率引入介电膜材料中。我们表明，激光产生的表面声波可以成功，快速地表征这些薄膜的孔隙率/密度和刚度。 X射线反射率和布里渊光散射的补充测量结果验证了我们的结果。我们讨论了为什么纳米压痕会带来困难。

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《Review of Progress in Quantitative Nondestructive Evaluation》|2003年|p.1463-1470|共8页
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Colm M. Flannery; D. C. Hurley;
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中图分类机械、仪表工业;
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LASER ULTRASOUND: AN INSPECTION TOOL OF SOFT POROUS LOW-DIELECTRIC CONSTANT FILMS FOR MICROELECTRONIC INTERCONNECT

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