The development of semiconducting fiberglass tapes LSP-O, their properties, and their use for anti-corona protection of high voltage windings

机译：半导体玻璃纤维带LSP-O的开发，性能及其在高压绕组的抗电晕保护中的用途

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Semiconducting fiberglass tapes were developed in order to achieve a stable, heat-resistant, chemically homogeneous semiconducting material with electrical resistance, which would be independent of the probability of the distribution of semiconducting fillers (such as carbon-black or SiC) in the dielectric binders, and in order to avoid the influence on the material resistance of the binder thickening degree during manufacture of the winding and the aging in operation.

机译：开发半导电玻璃纤维带是为了获得一种稳定，耐热，化学均匀的具有电阻的半导体材料，该材料与半导电填料（例如炭黑或SiC）在介电粘合剂中的分布概率无关。并且，为了避免对绕组制造过程中粘合剂增稠度的材料阻力和操作时效的影响。

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《Conference Record of the 2010 IEEE International Symposium on Electrical Insulation》|2010年|P.1-4|共4页
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Malamud R.; Zueva V.; Sumovskaya G.; Stepanova T.;
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中图分类自动化技术、计算机技术;
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The development of semiconducting fiberglass tapes LSP-O, their properties, and their use for anti-corona protection of high voltage windings

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